Company Interview / How Adisyn's graphene technology could reshape semiconductors

Key points:

Graphene process aims to replace copper interconnects at sub‑450°C Target customers include Intel, TSMC, Micron and Nvidia Scaling from 1cm coupons to 300mm wafers expected over 12–18 months Commercialisation paths span JVs, licensing, royalties and strategic stakes

Kevin Crofton from Adisyn sets out how a new graphene deposition process could reshape next‑generation semiconductors as AI demand accelerates. Crofton states Adisyn is able to lay graphene at temperatures below 450°C in layers as thin as one nanometre, in environments compatible with existing copper processes in major fabs. In his view, this could allow graphene to replace copper as the conductor of choice in many semiconductor devices, boosting performance while improving heat dissipation.

Crofton explains that the technology is currently demonstrated on a 1cm x 1cm coupon, roughly the size of a typical chip. The next step, he says, is scaling to 300mm wafers, proving integration into existing process flows and validating long‑term reliability. He estimates a 12–18 month window for full‑scale chip integration before major industry players begin to pull the technology into production.

According to Crofton, the largest semiconductor and AI chip manufacturers — including Intel (NASDAQ:INTC), TSMC (NYSE:TSM), Micron (NASDAQ:MU) and Nvidia (NASDAQ:NVDA) — could become significant adopters, particularly as AI is projected to represent about 70% of a forecast US$1.2 trillion semiconductor market by 2030. He outlines multiple commercialisation options, including joint ventures, paid integration work, licensing royalties and potential strategic investment.